ELECTRODEPOSITION OF COPPER POWDER FROM MIXTURE SULPHATE –CHLORIDE ACIDIC SOLUTION

Abstract

This paper studies the preparation of Copper powder from Copper Sulphate aqueous
solution(CuSO4.5H2O), sulfuric acid (H2SO4) and copper chloride (CuCl2.2H2O)by using
the process of electro-deposition. Process of Powder deposition have been investigated for
copper powder, it is a fine layer on cathode electrode by using the value of different from
current densities (0.12, 0.14, 0.16, and 0.18) A/cm2
.as it is noticed the weight of the powder
rises with there is of current density. Diffractions of X-ray (XRD) revealed high crystallinity
and pure copper powder not contain impurity or oxides. Size of the Crystallite has been
measured by Scherrer's Formula about (38.44 -43.161) nm. Optical microscopes have
revealed the particles of copper have dendritic shapes. The size of Particles analyzer
measured the size of a particle which is about (2.4 – 8.7) ?m.